Mark Chou
7Patents
3h-index
16Co-inventors
50Inventor score
Filing activity: Apr 29, 2003 → Jun 27, 2017
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US7470997B2 | Wirebond pad for semiconductor chip or wafer | Electricity | 47 | Expired |
| US8187965B2 | Wirebond pad for semiconductor chip or wafer | Electricity | 12 | Active |
| US10537983B2 | Modular power tool | Human Necessities | 5 | Active |
| US8529136B2 | High temperature ball bearing | Emerging Cross-Sectional Technologies | 3 | Active |
| US10420287B2 | Pole assembly for vegetation cutting tool | Human Necessities | 3 | Active |
| US6840677B2 | Ceramic bearing structure | Mechanical Engineering; Lighting; Heating | 1 | Expired |
| US7554208B2 | Wirebond pad for semiconductor chip or wafer | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.