Mark G. Fernandes
4Patents
4h-index
13Co-inventors
43Inventor score
Filing activity: Feb 18, 1992 → Mar 2, 1998
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US5310626A | Method for forming a patterned layer using dielectric materials as a light-sensitive material | Electricity | 31 | Expired |
| US6045435A | Low selectivity chemical mechanical polishing (CMP) process for use on integrated circuit metal interconnects | Electricity | 22 | Expired |
| US5317185A | Semiconductor device having structures to reduce stress notching effects in conductive lines and method for making the same | Electricity | 10 | Expired |
| US6136678A | Method of processing a conductive layer and forming a semiconductor device | Electricity | 8 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.