Mark Hollatz
7Patents
3h-index
13Co-inventors
50Inventor score
Filing activity: May 28, 2002 → Dec 29, 2011
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US9238877B2 | Method for producing a silicon ingot by solidification of a melt comprising a nucleation agent including nanoscale particles | Chemistry; Metallurgy | 32 | Active |
| US6824451B2 | Process for the abrasive machining of surfaces, in particular of semiconductor wafers | Emerging Cross-Sectional Technologies | 13 | Expired |
| US6695687B2 | Semiconductor substrate holder for chemical-mechanical polishing containing a movable plate | Performing Operations; Transporting | 7 | Expired |
| US7326612B2 | Method for fabricating a semiconductor structure | Electricity | 0 | Active |
| US7030017B2 | Method for the planarization of a semiconductor structure | Electricity | 0 | Expired |
| US6858449B2 | Process and device for the abrasive machining of surfaces, in particular semiconductor wafers | Performing Operations; Transporting | 0 | Expired |
| US9114990B2 | Device and method for the production of silicon blocks | Chemistry; Metallurgy | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.