Semiconductor substrate holder for chemical-mechanical polishing containing a movable plate

US6695687B2 · kind B2 · utility

Assignee

• Infineon Technologies AG · DE

Inventors

• Mark Hollatz · Neustadt, DE
• Peter Lahnor · Dresden, DE

Key dates

• Filing date: May 28, 2002
• Grant date: Feb 24, 2004
• Expiry date: Jul 28, 2022

Classification

• Technology area (CPC B): Performing Operations; Transporting
• CPC primary: B24B41/06
• WIPO field: Machine tools
• WIPO sector: Mechanical engineering

Abstract

A substrate holder is described which has a movable plate elastically mounted inside a main body. With the substrate holder, a polishing operation can be performed in two basic operation modes corresponding to two different vertical end positions of the movable plate. In a first (downward) mode the movable plate stays in mechanical contact with the substrate whereas in a second (upward) mode an air cushion is generated in a chamber between the movable plate and the substrate for pressurizing the substrate onto the polishing pad.