Integrated circuit (IC) package with cantilever multi-chip module (MCM) heat spreader
US11948855B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | May 3, 2022 |
| Grant date | Apr 2, 2024 |
| Priority date | — |
| Expiry date | May 3, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L25/0655
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An integrated circuit (IC) package comprises a substrate having an outer portion close to the perimeter of the substrate, an inner portion surrounded by the outer portion, and an upper surface incorporating a wiring layer for the bonding of a semiconducting die (e.g., via its bottom face). The IC package includes a metallic or otherwise thermally conductive heat spreader thermally bonded on an inner surface of a boss on its bottom side to the top surface of the semiconducting die, and extending on its top surface to the edges of the substrate to maximize heat dissipation from the die. The boss extends toward the semiconducting die and is thermally coupled to the top face of the semiconducting die.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.