Mei Shen
2Patents
1h-index
13Co-inventors
41Inventor score
Filing activity: Aug 22, 2005 → Jul 6, 2020
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US7964512B2 | Method for etching high dielectric constant materials | Electricity | 2 | Expired |
| US11170863B2 | Multi-bit-per-cell three-dimensional resistive random-access memory (3D-RRAM) | Physics | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.