Miao Yubo
5Patents
5h-index
1Co-inventors
42Inventor score
Filing activity: Oct 29, 2004 → Jan 28, 2008
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US7202552B2 | MEMS package using flexible substrates, and method thereof | Electricity | 94 | Expired |
| US7329933B2 | Silicon microphone with softly constrained diaphragm | Electricity | 43 | Expired |
| US7346178B2 | Backplateless silicon microphone | Electricity | 40 | Active |
| US7692288B2 | MEMS packaging method for enhanced EMI immunity using flexible substrates | Electricity | 23 | Active |
| US8045734B2 | Backplateless silicon microphone | Electricity | 15 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.