MEMS package using flexible substrates, and method thereof
US7202552B2 · kind B2 · utility
94Cited by
6References
31Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 15, 2005 |
| Grant date | Apr 10, 2007 |
| Priority date | — |
| Expiry date | Oct 27, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3025
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A MEMS package and a method for its forming are described. The MEMS package has at least one MEMS device located on a flexible substrate. A metal structure surrounds the at least one MEMS device wherein a bottom surface of the metal structure is attached to the flexible substrate and wherein a portion of the flexible substrate is folded over a top surface of the metal structure and attached to the top surface of the metal structure thereby forming the MEMS package.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.