MEMS packaging method for enhanced EMI immunity using flexible substrates
US7692288B2 · kind B2 · utility
23Cited by
5References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 17, 2006 |
| Grant date | Apr 6, 2010 |
| Priority date | — |
| Expiry date | Apr 28, 2028 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3025
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A MEMS package and methods for its embodiment are described. The MEMS package has at least one MEMS device mounted on a flexible and foldable substrate. A metal cap structure surrounds the at least one MEMS device wherein an edge surface of the metal cap structure is attached to the flexible substrate and wherein a portion of the flexible substrate is folded under itself thereby forming the MEMS package. A meshed metal environmental hole underlying the at least one MEMS device provides enhanced EMI immunity.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.