Michael Sendler
7Patents
5h-index
7Co-inventors
48Inventor score
Filing activity: Nov 3, 1995 → Mar 19, 2002
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6884719B2 | Method for depositing a coating having a relatively high dielectric constant onto a substrate | Electricity | 70 | Expired |
| US5634974A | Method for forming hemispherical grained silicon | Emerging Cross-Sectional Technologies | 68 | Expired |
| US5759262A | Method of forming hemispherical grained silicon | Emerging Cross-Sectional Technologies | 60 | Expired |
| US5962065A | Method of forming polysilicon having a desired surface roughness | Emerging Cross-Sectional Technologies | 30 | Expired |
| US5688550A | Method of forming polysilicon having a desired surface roughness | Emerging Cross-Sectional Technologies | 14 | Expired |
| US6177127A | Method of monitoring emissivity | Emerging Cross-Sectional Technologies | 5 | Expired |
| US6444482B1 | Method of monitoring power supplied to heat a substrate | Emerging Cross-Sectional Technologies | 1 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.