Min-Yi Lin
2Patents
2h-index
3Co-inventors
30Inventor score
Filing activity: Apr 29, 1996 → Mar 10, 2000
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6297554A | Dual damascene interconnect structure with reduced parasitic capacitance | Electricity | 209 | Expired |
| US5652172A | Method for controlling the etch profile of an aperture formed through a multi-layer insulator layer | Electricity | 10 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.