Ming-Hsuan WANG
2Patents
1h-index
6Co-inventors
30Inventor score
Filing activity: Oct 31, 2017 → Mar 11, 2021
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US10453803B2 | Wiring substrate having alternating ground and signal lines in a plurality of wiring layers | Electricity | 1 | Active |
| US11600572B2 | Routing structure between dies and method for arranging routing between dies | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.