Routing structure between dies and method for arranging routing between dies
US11600572B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Mar 11, 2021 |
| Grant date | Mar 7, 2023 |
| Priority date | — |
| Expiry date | Mar 11, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/15311
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A routing structure between dies is provided, including a trace layer, disposed on a substrate, wherein a plurality of routing paths is embedded in the trace layer. In addition, a first die and a second die are disposed on the trace layer and connected by the routing paths. A spacing gap between the first die and the second die is along a first direction and interfacing edges of the first die and the second die are extending along a second direction perpendicular to the first direction. Each of the routing paths includes a first straight portion in parallel to connect to the interfacing edges. The first straight portion has a slant angle with respect to the first direction other than 0° and 90°.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.