Ming Li
5Patents
3h-index
17Co-inventors
50Inventor score
Filing activity: Jul 16, 2007 → Oct 4, 2021
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US9425150B2 | Multi-via interconnect structure and method of manufacture | Electricity | 15 | Active |
| US10589327B2 | Apparatus and method for rolling metal | Emerging Cross-Sectional Technologies | 4 | Active |
| US8022446B2 | Integrated Schottky diode and power MOSFET | Electricity | 3 | Active |
| US11646284B2 | Method and apparatus to improve connection pitch in die-to-wafer bonding | Electricity | 0 | Active |
| US11404464B2 | Image sensing device and method of forming the same | Physics | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.