Ming Xia Wu
2Patents
1h-index
9Co-inventors
27Inventor score
Filing activity: Jun 22, 2017 → Feb 28, 2018
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US10483239B2 | Semiconductor device including dual pad wire bond interconnection | Electricity | 2 | Active |
| US10128218B2 | Semiconductor device including die bond pads at a die edge | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.