Semiconductor device including dual pad wire bond interconnection
US10483239B2 · kind B2 · utility
2Cited by
6References
22Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 28, 2018 |
| Grant date | Nov 19, 2019 |
| Priority date | — |
| Expiry date | Feb 28, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D89/013
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device is disclosed including semiconductor die formed with a row of functional die bond pads and an adjacent row of dummy die bond pads. The functional die bond pads may be electrically connected to the integrated circuits formed within the semiconductor die. The dummy die bond pads may be formed in the scribe area of a semiconductor wafer from which the semiconductor die are formed, and are provided for wire bonding the semiconductor die within the semiconductor device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.