Noboru Okane
2Patents
1h-index
7Co-inventors
30Inventor score
Filing activity: Apr 6, 2006 → Sep 22, 2009
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US7569921B2 | Semiconductor device and manufacturing method thereof | Electricity | 5 | Active |
| US8231046B2 | Wire bonding apparatus and wire bonding method | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.