Wire bonding apparatus and wire bonding method
US8231046B2 · kind B2 · utility
0Cited by
6References
4Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 22, 2009 |
| Grant date | Jul 31, 2012 |
| Priority date | — |
| Expiry date | Sep 22, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/01082
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A wire bonding method involves bonding a wire in order at a first bonding point and a second bonding point; raising a capillary, through which the wire is inserted, on the second bonding point; cutting the wire by closing a clamper provided above the capillary at a time when the capillary has reached a prescribed height; and measuring a load incurred on the wire at a time of cutting of the wire.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.