Method for picking up semiconductor chips from a wafer table and method for mounting semiconductor chips on a substrate
US8133823B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 8, 2008 |
| Grant date | Mar 13, 2012 |
| Priority date | — |
| Expiry date | Jan 12, 2031 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG05B2219/50023
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The invention relates to a method for picking up semiconductor chips from a wafer table and, optionally, their mounting on a substrate by means of a pick-and-place system. The position and orientation of the semiconductor chip to be mounted next are determined by means of a first camera and made available in the form of positional data relating to a first system of coordinates. The position and orientation of the substrate place on which the semiconductor chip will be mounted are determined by means of a second camera and made available in the form of positional data relating to a second system of coordinates. The conversion of coordinates of the first or second system of coordinates into coordinates of motion of the pick-and-place system occurs by means of two fixed mapping functions and two changeable correction vectors. The correction vectors are readjusted on the occurrence of a predetermined event.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.