Patrick Clark
6Patents
2h-index
10Co-inventors
44Inventor score
Filing activity: Nov 20, 2001 → Jan 31, 2013
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US7972650B1 | Method for manufacturing 3D circuits from bare die or packaged IC chips by microdispensed interconnections | Electricity | 25 | Active |
| US6812309B2 | Digitally encoded polymers | Chemistry; Metallurgy | 3 | Expired |
| US10059056B2 | Micro-dispensing multi-layered 3D objects with curing steps | Emerging Cross-Sectional Technologies | 2 | Active |
| US8790742B2 | Method for manufacturing 3D circuits from bare die or packaged IC chips by microdispensed interconnections | Electricity | 1 | Active |
| US6713557B2 | Redox system and process | Chemistry; Metallurgy | 0 | Expired |
| US12052828B2 | Dispensing patterns including lines and dots at high speeds | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.