Inventor · New Taipei, TW

Paul Chen

24Patents
12h-index
16Co-inventors
78Inventor score

Filing activity: Aug 5, 1991 → Apr 29, 2021

Most-cited inventions

PatentTitleAreaCited byStatus
USD671259S1 Non-opaque light cover for a light fixture General 93 Active
US5333252A Interface for arranging order of fields Physics 66 Expired
US5217150A Belt buckle with a cutting tool incorporated therein Performing Operations; Transporting 43 Expired
USD730570S1 Non-opaque light cover for light fixture General 36 Active
USD759287S1 Light fixture including a non-opaque light cover secured to light fixture body General 33 Active
USD731111S1 Non-opaque light cover for a light fixture General 30 Active
USD759286S1 Light fixture including non-opaque light cover General 30 Active
USD381887S Handel grip General 29 Expired
US5654785A Foldable, easily stored sunglasses Physics 18 Expired
USD696451S1 Light fixture including non-opaque light cover and light fixture body General 16 Active
USD769509S1 Light fixture including non-opaque light cover General 15 Active
US6533411B1 Eyeglass assembly having a coupling unit for coupling primary and auxiliary eyeglasses Physics 12 Expired
US6167599A Light reflecting tag attached to ends of a shoelace Emerging Cross-Sectional Technologies 11 Expired
US5911830A Method and fixture for laser bar facet coating Electricity 11 Expired
USD442361S Shoelace General 10 Expired
US5946779A Shoelace having sections of different diameters and densities Emerging Cross-Sectional Technologies 10 Expired
USD431717S Shoelace General 8 Expired
US6037006A Method and fixture for laser bar facet coating Electricity 6 Expired
US6119591A Processing method for undetachably printing pictures on surface of a fastening sheath for shoe lace head Emerging Cross-Sectional Technologies 5 Expired
US6412944B1 Eyeglasses with coupling units for coupling temples and lenses thereof Physics 5 Expired
US7170167B2 Method for manufacturing wafer level chip scale package structure Electricity 5 Expired
US7211500B2 Pre-process before cutting a wafer and method of cutting a wafer Electricity 2 Expired
US11293829B1 Liquid sensor assembly Performing Operations; Transporting 1 Active
US5940160A Spectacles Physics 0 Expired

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.