Pre-process before cutting a wafer and method of cutting a wafer
US7211500B2 · kind B2 · utility
2Cited by
7References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 27, 2004 |
| Grant date | May 1, 2007 |
| Priority date | — |
| Expiry date | May 23, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/78
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A pre-process before cutting a wafer is described. The wafer includes a plurality of scribe lines and a plurality of dies defined by the scribe lines, and a material layer covers the wafer. A pre-processing step is performed to remove the material layer on the scribe lines close to the corner regions of the dies. Removing the material layer at the corner regions before cutting the wafer is able to preserve the integrity of the corner regions of the cut dies.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.