Pete Benson
7Patents
6h-index
8Co-inventors
48Inventor score
Filing activity: Mar 31, 2003 → Dec 10, 2008
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6841883B1 | Multi-dice chip scale semiconductor components and wafer level methods of fabrication | Electricity | 455 | Expired |
| US7498675B2 | Semiconductor component having plate, stacked dice and conductive vias | Electricity | 273 | Active |
| US7060526B2 | Wafer level methods for fabricating multi-dice chip scale semiconductor components | Electricity | 57 | Expired |
| US7459393B2 | Method for fabricating semiconductor components with thinned substrate, circuit side contacts, conductive vias and backside contacts | Electricity | 52 | Active |
| US6998717B2 | Multi-dice chip scale semiconductor components | Electricity | 39 | Expired |
| US7224051B2 | Semiconductor component having plate and stacked dice | Electricity | 22 | Expired |
| US8924274B2 | For and method of providing portfolio risk information to investors without revealing position information | Physics | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.