Peter Bainschab
2Patents
0h-index
13Co-inventors
28Inventor score
Filing activity: Oct 30, 2017 → Dec 13, 2019
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US10582609B2 | Integration of through glass via (TGV) filter and acoustic filter | Electricity | 0 | Active |
| US12071339B2 | Micro-acoustic wafer-level package and method of manufacture | Performing Operations; Transporting | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.