Micro-acoustic wafer-level package and method of manufacture
US12071339B2 · kind B2 · utility
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5References
20Claims
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Assignee
Inventors
Key dates
| Filing date | Dec 13, 2019 |
| Grant date | Aug 27, 2024 |
| Priority date | — |
| Expiry date | May 6, 2041 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB81C2203/037
- WIPO fieldBasic communication processes
- WIPO sectorElectrical engineering
Abstract
A wafer-level package for micro-acoustic devices and a method of manufacture is provided. The package comprises a base wafer with electric device structures. A frame structure is sitting on top of the base wafer enclosing particular device areas for the micro-acoustic devices. A cap wafer provided with a thin polymer coating is bonded to the frame structure to form a closed cavity over each device area and to enclose within the cavity the device structures arranged on the respective device area.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.