Patent · US Active

Integration of through glass via (TGV) filter and acoustic filter

US10582609B2 · kind B2 · utility

0Cited by

2References

19Claims

0Family size

Assignee

QUALCOMM Incorporated · US

Inventors

Changhan Hobie Yun · San Diego, US
Jonghae Kim · San Diego, US
Xiaoju YU · San Diego, US
Mario Francisco Velez · San Diego, US
Wei-Chuan Chen · Taipei, TW
Niranjan Sunil Mudakatte · San Diego, US
Matthew Michael Nowak · San Diego, US
Christian Hoffmann · Leonberg, DE
Rodrigo PACHER FERNANDES · Wolfsberg, AT
Manuel Hofer · Wolfsberg, AT
Peter Bainschab · Wolfsberg, AT
Edgar Schmidhammer · Stein an der Traun, DE
Stefan Leopold Hatzl

Key dates

Filing date	Oct 30, 2017
Grant date	Mar 3, 2020
Priority date	—
Expiry date	Apr 3, 2038

Classification

Technology area (CPC H)Electricity
CPC primaryH05K3/32
WIPO fieldBasic communication processes
WIPO sectorElectrical engineering

Abstract

A passive on glass (POG) on filter capping apparatus may include an acoustic filter die. The apparatus may further include a capping die electrically coupled to the acoustic filter die. The capping die may include a 3D inductor.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.