Peter C. Wade
2Patents
2h-index
4Co-inventors
27Inventor score
Filing activity: Jun 8, 2000 → Jun 22, 2000
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6531069B1 | Reactive Ion Etching chamber design for flip chip interconnections | Electricity | 109 | Expired |
| US6293457A | Integrated method for etching of BLM titanium-tungsten alloys for CMOS devices with copper metallization | Electricity | 39 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.