Peter Gansauge
3Patents
3h-index
4Co-inventors
43Inventor score
Filing activity: Jan 23, 1975 → Apr 11, 1991
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US5244833A | Method for manufacturing an integrated circuit chip bump electrode using a polymer layer and a photoresist layer | Electricity | 92 | Expired |
| US5010389A | Integrated circuit substrate with contacts thereon for a packaging structure | Electricity | 39 | Expired |
| US3960605A | Method of implantation of boron ions utilizing a boron oxide ion source | Electricity | 19 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.