Peter Lieu
2Patents
1h-index
3Co-inventors
27Inventor score
Filing activity: Sep 12, 2011 → Oct 12, 2011
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US8586407B2 | Method for depackaging prepackaged integrated circuit die and a product from the method | Electricity | 1 | Active |
| US8609473B2 | Method for fabricating a neo-layer using stud bumped bare die | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.