Pramod D. Patel
2Patents
2h-index
3Co-inventors
27Inventor score
Filing activity: Apr 26, 2000 → Jul 25, 2000
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6548881B1 | Method and apparatus to achieve bond pad crater sensing and stepping identification in integrated circuit products | Electricity | 10 | Expired |
| US6373126B1 | Method for reducing IC package delamination by use of internal baffles | Electricity | 2 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.