Method and apparatus to achieve bond pad crater sensing and stepping identification in integrated circuit products
US6548881B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 25, 2000 |
| Grant date | Apr 15, 2003 |
| Priority date | — |
| Expiry date | Aug 23, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3011
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Method for stepping identification and bond pad crater jeopardy identification in integrated circuits and apparatus which performs the method, A unique device, a polysilicon meander, is formed under each bond pad in the integrated circuit device. Connected to the meander is circuitry for determining the electrical, and hence mechanical, integrity of the meander. Failure of the meander by reason of microcrack formation in the several layers under the meander is detected by the high resistance of the meander. The circuitry will also resolve any potential mismatch between the actual mask revision of the integrated circuit and the corresponding revision of the test program.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.