Prashant Parmar
2Patents
1h-index
14Co-inventors
41Inventor score
Filing activity: Jun 4, 2003 → Sep 28, 2017
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US7321167B2 | Flex tape architecture for integrated circuit signal ingress/egress | Electricity | 24 | Expired |
| US10475736B2 | Via architecture for increased density interface | Electricity | 1 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.