Flex tape architecture for integrated circuit signal ingress/egress
US7321167B2 · kind B2 · utility
24Cited by
8References
5Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 4, 2003 |
| Grant date | Jan 22, 2008 |
| Priority date | — |
| Expiry date | Jul 12, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3025
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
In an integrated circuit design, flex tape is used to provide signal ingress/egress to/from the integrated circuit design. Various architectures for the signal ingress/egress via flex tape is provided. In one embodiment, coaxial design is provided. In another embodiment, a coplanar waveguide design is provided.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.