Rahamat Bidin
3Patents
2h-index
6Co-inventors
37Inventor score
Filing activity: Sep 14, 1999 → Jun 28, 2011
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6420779B1 | Leadframe based chip scale package and method of producing the same | Electricity | 225 | Expired |
| US8544755B2 | Subscriber identity module (SIM) card | Electricity | 2 | Active |
| US7816775B2 | Multi-die IC package and manufacturing method | Electricity | 1 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.