Raul Mancera
4Patents
3h-index
4Co-inventors
36Inventor score
Filing activity: May 30, 2007 → Nov 29, 2010
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US7882628B2 | Multi-chip packaging using an interposer such as a silicon based interposer with through-silicon-vias | Emerging Cross-Sectional Technologies | 10 | Active |
| US7576434B2 | Wafer-level solder bumps | Electricity | 8 | Active |
| US7841080B2 | Multi-chip packaging using an interposer with through-vias | Emerging Cross-Sectional Technologies | 6 | Active |
| US8387240B2 | Methods for making multi-chip packaging using an interposer | Emerging Cross-Sectional Technologies | 1 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.