Methods for making multi-chip packaging using an interposer
US8387240B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 29, 2010 |
| Grant date | Mar 5, 2013 |
| Priority date | — |
| Expiry date | Jan 14, 2031 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49165
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
In one embodiment, a method includes forming a plurality of vias partially through a body, the vias including sidewalls defined by the body. An electrically insulating layer is formed on the sidewalls and on an upper surface of the body. An electrically conductive layer is formed on the insulating layer in the vias and on the upper surface, the electrically conductive layer defining first metal pads on the upper surface and second metal pads in contact with the first metal pads, the second metal pads having a denser pitch than the first metal pads. A dielectric layer is formed between adjacent first metal pads and between adjacent second metal pads. The body is thinned through a lower surface and the electrically insulating layer in the vias is exposed. After the thinning, a portion of the electrically insulating layer in the, vias is removed. The body is coupled to a substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.