Rex Anderson
4Patents
4h-index
5Co-inventors
36Inventor score
Filing activity: Sep 8, 2009 → Aug 8, 2012
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US7994045B1 | Bumped chip package fabrication method and structure | Electricity | 21 | Active |
| US8263486B1 | Bumped chip package fabrication method and structure | Electricity | 6 | Active |
| US8552557B1 | Electronic component package fabrication method and structure | Electricity | 5 | Active |
| US8426966B1 | Bumped chip package | Electricity | 4 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.