Inventor · New Paltz, NY, US

Richard P. Snider

8Patents
4h-index
15Co-inventors
43Inventor score

Filing activity: Feb 27, 2013 → Jun 17, 2016

Most-cited inventions

PatentTitleAreaCited byStatus
US9504184B2 Flexible coolant manifold-heat sink assembly Electricity 12 Active
US9913403B2 Flexible coolant manifold—heat sink assembly Electricity 11 Active
US9298231B2 Methods of fabricating a coolant-cooled electronic assembly Emerging Cross-Sectional Technologies 7 Active
US9497888B2 Thermal transfer structure(s) and attachment mechanism(s) facilitating cooling of electronics card(s) Emerging Cross-Sectional Technologies 6 Active
US9265178B2 Thermal transfer and coolant-cooled structures facilitating cooling of electronics card(s) Emerging Cross-Sectional Technologies 4 Active
US9648786B2 Interlock assembly for air-moving assembly Electricity 4 Active
US9253923B2 Fabricating thermal transfer and coolant-cooled structures for cooling electronics card(s) Emerging Cross-Sectional Technologies 2 Active
US9629284B2 Interlock assembly for air-moving assembly Electricity 2 Active

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.