Thermal transfer structure(s) and attachment mechanism(s) facilitating cooling of electronics card(s)

US9497888B2 · kind B2 · utility

Assignee

• International Business Machines Corporation · US

Inventors

• Amilcar R. Arvelo · Poughkeepsie, US
• Levi A. Campbell · Poughkeepsie, US
• Michael J. Ellsworth, Jr. · Poughkeepsie, US
• Eric J. McKeever · Poughkeepsie, US
• Richard P. Snider · New Paltz, US

Key dates

• Filing date: Feb 27, 2013
• Grant date: Nov 15, 2016
• Expiry date: Jul 27, 2035

Classification

• Technology area (CPC Y): Emerging Cross-Sectional Technologies
• CPC primary: Y10T29/4935
• WIPO field: Thermal processes and apparatus
• WIPO sector: Mechanical engineering

Abstract

Cooling apparatuses and coolant-cooled electronic assemblies are provided which include a thermal transfer structure configured to couple to one or more sides of an electronics card having one or more electronic components to be cooled. The thermal transfer structure includes a thermal spreader and at least one coolant-carrying channel associated with the thermal spreader to facilitate removal of heat from the thermal spreader to coolant flowing through the coolant-carrying channel(s). The cooling apparatus further includes a coolant manifold structure disposed adjacent to a socket of the electronic system within which the electronics card operatively docks, and a fluidic and mechanical attachment mechanism which facilitates selective, fluidic and mechanical coupling or decoupling the thermal transfer structure and coolant manifold structure, the attachment mechanism facilitating the flow of coolant between the coolant manifold structure and the coolant-carrying channel(s) of the thermal transfer structure.