Patent · US Active

Flexible coolant manifold—heat sink assembly

US9913403B2 · kind B2 · utility

11Cited by
25References
15Claims
0Family size

Assignee

Inventors

Key dates

Filing dateJun 17, 2016
Grant dateMar 6, 2018
Priority date
Expiry dateJun 17, 2036

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH05K7/20781
  • WIPO fieldAudio-visual technology
  • WIPO sectorElectrical engineering

Abstract

A cooling assembly is provided which includes: one or more coolant-cooled heat sinks configured to couple to one or more electronic components to be cooled; one or more flexible coolant conduits; and one or more pivotable coolant manifolds. The flexible coolant conduit(s) couples in fluid communication the pivotable coolant manifold(s) and the coolant-cooled heat sink(s), and accommodates pivoting of the pivotable coolant manifold(s), while maintaining the coolant-cooled heat sink(s) in fluid communication with the pivotable coolant manifold(s). In one or more embodiments, the pivotable coolant manifold(s) pivots between a first position laterally offset from one or more of the coolant-cooled heat sink(s), and a second position above the one or more coolant-cooled heat sinks. First and second pivot arms may be provided at opposite ends of the pivotable coolant manifold(s) to facilitate pivotable movement of the manifold(s) between the first position and the second position.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.