Richard Yang
2Patents
2h-index
5Co-inventors
30Inventor score
Filing activity: May 17, 1996 → Jun 30, 1997
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6042687A | Method and apparatus for improving etch and deposition uniformity in plasma semiconductor processing | Electricity | 99 | Expired |
| US5827437A | Multi-step metallization etch | Electricity | 23 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.