Robert Burtzlaff
2Patents
2h-index
16Co-inventors
34Inventor score
Filing activity: Sep 24, 2004 → Jan 19, 2007
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US7936062B2 | Wafer level chip packaging | Electricity | 54 | Active |
| US7224056B2 | Back-face and edge interconnects for lidded package | Electricity | 36 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.