Robert J. Harendza
2Patents
2h-index
7Co-inventors
27Inventor score
Filing activity: Jan 12, 2007 → Mar 30, 2007
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US7596863B2 | Method of providing a printed circuit board with an edge connection portion and/or a plurality of cavities therein | Emerging Cross-Sectional Technologies | 12 | Active |
| US7910156B2 | Method of making circuitized substrate with selected conductors having solder thereon | Electricity | 3 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.