Method of making circuitized substrate with selected conductors having solder thereon
US7910156B2 · kind B2 · utility
3Cited by
16References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 30, 2007 |
| Grant date | Mar 22, 2011 |
| Priority date | — |
| Expiry date | Dec 15, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/0577
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A method of making a circuitized substrate in which conductors are formed in such a manner that selected ones of the conductors include solder while others do not and are thus adapted for receiving a different form of connection (e.g., wire-bond) than the solder covered conductors. In one embodiment, the solder may be applied in molten form by immersing the substrate within a bath of the solder while in another the solder may be deposited using a screening procedure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.