Method of providing a printed circuit board with an edge connection portion and/or a plurality of cavities therein
US7596863B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 12, 2007 |
| Grant date | Oct 6, 2009 |
| Priority date | — |
| Expiry date | Jan 11, 2028 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49169
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method of making a printed circuit board in which at least three substrates are aligned and bonded together (e.g., using lamination). Two of the substrates have openings formed therein, with each opening including a cover member located therein. During lamination, the cover members for a seal and prevent dielectric material (e.g., resin) liquefied during the lamination from contacting the conductive layers on the opposed surfaces of the inner (first) substrate. A PCB is thus formed with either a projecting edge portion or a plurality of cavities therein such that electrical connection may be made to the PCB using an edge connector or the like.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.