Method for wire bonding an aluminum wire to a lead of an electronics package
US5492263A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | May 26, 1994 |
| Grant date | Feb 20, 1996 |
| Priority date | — |
| Expiry date | May 26, 2014 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/1275
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A method is provided for wire bonding an aluminum wire to a surface of a lead of an electronics package. The method entails a nickel plating process and an ultrasonic bonding process which together cooperate to form a reliable and highly repeatable joint between the wire and the lead member. The ultrasonic bonding process is specifically tailored to the nickel plating produced by the plating process, so as to significantly enhance the bond strength of the resulting ultrasonic bond joint. The plating process is devised to produce a nickel plating which is thicker than that generally practiced, and whose surface is characterized as having a relatively smooth microfinish which unexpectedly serves to enhance the bond strength of the ultrasonic bond joint.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.