Ronald E. Paulsen
3Patents
3h-index
7Co-inventors
36Inventor score
Filing activity: Jan 20, 2006 → Aug 9, 2007
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US7482251B1 | Etch before grind for semiconductor die singulation | Electricity | 35 | Active |
| US7651882B1 | RFID tag circuit die with shielding layer to control I/O bump flow | Electricity | 19 | Active |
| US7667231B2 | Automatic on-die defect isolation | Physics | 18 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.