Ross B. Berntson
5Patents
1h-index
5Co-inventors
36Inventor score
Filing activity: Dec 6, 2017 → May 18, 2022
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US10943796B2 | Semiconductor device assembly having a thermal interface bond between a semiconductor die and a passive heat exchanger | Electricity | 2 | Active |
| US10607857B2 | Semiconductor device assembly including a thermal interface bond between a semiconductor die and a passive heat exchanger | Electricity | 1 | Active |
| US10943795B2 | Apparatus and methods for creating a thermal interface bond between a semiconductor die and a passive heat exchanger | Electricity | 1 | Active |
| US11766721B2 | Thermally decomposing build plate for facile release of 3D printed objects | Emerging Cross-Sectional Technologies | 0 | Active |
| US12300567B2 | Solid metal foam thermal interface material | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.