Solid metal foam thermal interface material
US12300567B2 · kind B2 · utility
0Cited by
8References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 18, 2022 |
| Grant date | May 13, 2025 |
| Priority date | — |
| Expiry date | Nov 6, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/16598
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Solid metal foam thermal interface materials and their uses in electronics assembly are described. In one implementation, a method includes: applying a thermal interface material (TIM) between a first device and a second device to form an assembly having a first surface of the TIM in in touching relation with a surface of the first device, and a second surface of the TIM opposite the first surface in touching relation with a surface of the second device, the TIM comprising a solid metal foam and a first liquid metal; and compressing the assembly to form an alloy from the TIM that bonds the first device to the second device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.