Rupert Burbidge
3Patents
0h-index
7Co-inventors
24Inventor score
Filing activity: Jun 6, 2011 → Apr 16, 2015
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US8987898B2 | Semiconductor wafer with reduced thickness variation and method for fabricating same | Electricity | 0 | Active |
| US9362221B2 | Surface mountable power components | Electricity | 0 | Active |
| US9012990B2 | Surface mountable power components | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.